Dr. Lameck Banda holds a doctorate in Chemical Engineering from Texas Tech University, Texas (USA), and another doctorate in Polymer Science and Engineering from the Kyoto Institute of Technology, Kyoto, (Japan). Before that, he obtained his Master of Science and Bachelor of Science degrees from the University of Manchester, Manchester (UK), and the University of Zambia, Lusaka (Zambia), respectively. Dr. Banda has worked both in industry and academia at home and abroad. He was a Research Scientist with the Dow Chemical Company in the USA where he conducted applied research in various segments including fracture toughness for high thermal stability materials applied in electrical laminates for printed circuit boards, materials used in frac plugs for enhanced oil recovery, composite materials for various engineering applications, carbon-carbon composites, and materials for light management applications. He holds several publications in peer-reviewed Journals, made oral presentations at several science conferences across geographies, and holds several USA Priority Patent Applications. He has received several awards and recognitions in his work such as the Innovation Award (Dow Epoxy, USA), Distinguished Committee Service Award (IPC Association Connecting Electronics Industries, USA), PerkinElmer Best Student Paper Award (PerkinElmer, SPE ANTEC, USA).  His research interests include structure-property relationships in polymeric materials, nanotechnology, real products, emerging technologies, environmental remediation, and advanced lightweight materials for aerospace applications. Dr. Banda is a Six Sigma Black Belt trained.